The goal of this activity the development of spiking skin for sensory feedback on prosthetic devices. The fellow
will first evaluate the properties of different transduction methods amenable to spiking implementation and their fit to the
needs of the prosthetic application, starting from the characterization of a skin prototype integrated on iLimb (Ossur,
previously developed by UNIBI). A novel methodology based on printed nanowires on flexible substrates will be then used
to develop neural nanowire FET and memristor assemblies. This technique will be then used to develop functional neural
element devices and components via modelling and practical fabrication. The in-depth investigation will involve the
heterogeneous integration of circuits on flexible substrates, printing of neural nanowire FET based circuits with well
controlled print dynamics, electro-mechanical characterization and modeling. Custom contact print set up will be used to
fabricate neural nanowire FETs circuits based neural backplane. The resulting neuromorphic flexible large area skin will be
integrated and validated on prosthetic devices
Expected Results
ESR8 will go beyond the current state of the art by developing large area printable neuromorphic
nanowire based backplane circuits for e-skin, and integrating it on prosthetic devices. The flexible skin will be designed in a
way that it can be used in the fingertips (high resolution for manipulation) but also on large areas, to cover most of the
prosthesis.
Planned Secondments
IIT-iCub:
to study neuromorphic circuits for POSFET, capacitive sensors;
EPFL:
to try tactile sensors on prosthesis;
OSSUR:
to test sensors on a prosthetic device;
Enrolments (in Doctoral degree/s)
University of Glasgow
Supervisors
R. Dahiya, C. Bartolozzi, S. Micera, SO from Ossur
ESR8: Optimization and integration of spiking tactile sensors on prosthetic devices
This project has received funding from the European Research Council (ERC) under the European Union’s Horizon 2020 research and innovation programme (Grant agreement No. 813713 ).